Processing Challenges in Semiconductor, Ceramic, Quartz, and Silicon Applications
In the processing of hard and brittle materials such as semiconductors, ceramics, quartz, and silicon, surface grinding plays a critical role far beyond dimensional correction. It directly impacts process yield, surface integrity, and downstream stability.
Due to their high hardness and brittleness, these materials demand significantly higher machining accuracy and machine stability than conventional metal components.
Key Requirements in Hard and Brittle Material Grinding
Ultra-High Flatness
Components used as process references, bonding surfaces, or vacuum interfaces require extremely high flatness to ensure stable downstream processes. Even minor deviations can impact photolithography alignment, bonding accuracy, or encapsulation stability.
Consistent Batch Quality
Grinding of hard and brittle materials often involves continuous production. Long-term consistency across all workpieces is just as critical as single-part accuracy to maintain yield and process reliability.
High Machining Stability
During grinding, hard and brittle materials are prone to micro-cracks, edge chipping, or surface damage. Any machine vibration, structural deformation, or spindle instability can significantly increase defect rates and rework risk.
Structural Solutions from Tong Yi Machinery
Tong Yi Machinery addresses these challenges with a structure-focused machine design, ensuring grinding precision remains stable during long-term operation:
High-Rigidity Machine Base
One-piece Meehanite cast iron construction provides excellent vibration damping and long-term structural stability, minimizing vibration effects on flatness and ensuring stable machining performance.
High-Stability Guideway System
Optimized guideway configuration reduces cumulative feed errors along each axis, ensuring consistent batch quality and long-term accuracy.
High-Precision Grinding Spindle
With spindle rotational accuracy below 1 μm, stable cutting performance and fine surface quality are maintained even during prolonged grinding operations of hard and brittle materials.
Precision That Lasts in Hard and Brittle Material Grinding
The real challenge in grinding hard and brittle materials lies not in short-term accuracy, but in the ability to consistently maintain precision over long production cycles.
By centering its design on structural rigidity, guideway stability, and spindle precision, Tong Yi Machinery delivers reliable, repeatable grinding machines for advanced material applications.