Machine Introduction
Semiconductor grinding machines are designed for high-precision machining of wafers, ceramics, quartz, silicon carbide, and other advanced materials. Their primary function is to achieve superior surface flatness, dimensional accuracy, and surface finish to meet the stringent requirements of semiconductor manufacturing processes.
Driven by the rapid growth of advanced packaging and next-generation chip production, grinding technology continues to advance toward higher efficiency, greater automation, and nanometer-level precision.
Built with a high-rigidity machine structure, these grinders effectively reduce vibration and ensure stable machining performance. The spindle system incorporates high-precision bearings and high-speed drive technology for smooth wheel rotation and consistent grinding quality. Combined with an advanced servo control system, the machine enables precise control of feed rate, grinding pressure, and travel speed, achieving micron-level machining accuracy.
Specification
| Description | VRT-600 |
| Rotary magnetic chuck dia. | 600mm |
| Max. grinding radius. | 300mm |
| Distance of table surface to spindle surface center. | 300mm |
| Rotary magnetic chuck speed. | 10-100r.p.m. |
| Rotary magnetic chuck horse power. | 3kw |
| Spindle motor. | 15/20HP(Opt.) |
| Spindle speed (50/60Hz) | MAX.2000r.p.m. |
| Auto down feed horse power. | 2kw |
| Vertical hand wheel downfeed per revolution. | 0.0001mm |
|
Vertical hand wheel downfeed per graduation.
|
<0.002mm
|
| Wheel size (dia x width x bore) | 350x70(3x5)x130mm |
| Net weight / gross weight (approx.) | 3200/3900kg |
| Packing size (LxWxH)(mm) | 2800x2300x2280mm |
※ The manufacturer reserves right to modify the design , specification mechanisms etc. without notice.
